09.11.2022

Engineer (m/f/d) for Packaging and Interconnection Technology

Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik (IHP), Frankfurt (Oder)

Engineer (m/f/d)

for Packaging and Interconnection Technology

Job-ID: 3079/22 | Department: System Architectures | Salary: as per tariff, up to EG 10 (according to degree); recognition of professional experience within the framework of TV-L possible | Working time: 40h/week (part-time work option) | Fixed term: initially 2 years, deferral is intended | Start: as soon as possible

Your Position:

As a member of the research group Integration Lab at IHP within the department System Architectures , you will be responsible, together with an experienced colleague, for all questions and work related to packaging and interconnect technologies with a focus on chip and wire bonding. The lab is part of the System Architectures department and provides its services to the entire IHP. Therefore, your tasks include not only managing the equipment, but also advising colleagues from engineering and research on the technical capabilities of the integration lab.

Your profile:

You hold successfully completed technical studies or completed technical vocational training with work experience. You are preferably experienced in semiconductor technologies and you have creativity and experimental skills for finding technical solutions and optimizing processes. Finally, outgoing and communicative personality with the ability to work with a wide variety of colleagues from all over the world is welcome.

Our offer:

Conducting research in a challenging, multinational environment giving you excellent career opportunities. You will have the chance to establish international reputation at the edge of top-notch technologies. An orientation guide will help you to quickly integrate into the institute and to familiarize yourself with the field.

Further Information Online Application Form